On behalf of the Organizing Committee, it is my great pleasure to welcome you to the 2026 Pan-Asia Conference on Circuits and Systems (PACCAS 2026), to be held from September 9 to 11, 2026, at the Wah Lee Conference Hall, Building of International Research, National Sun Yat-sen University, in Kaohsiung, Taiwan.
Jointly organized by National Sun Yat-sen University in Taiwan and SRM Institute of Science and Technology in India, and initiated through the IEEE Circuits and Systems Society communities in Taiwan and India, PACCAS 2026 reflects our shared commitment to advancing circuits and systems research while strengthening academic and professional ties across Asia and beyond. We are delighted to bring together researchers, students, and industry professionals to exchange ideas, present new discoveries, and explore opportunities for future collaboration.
The technical program captures the breadth and vitality of our field. The keynote presentations span low-capacitance ESD protection for high-speed circuits and systems, device-to-driver co-design for next-generation power semiconductors, and the convergence of AI, IoT, and IC hardware for precision aquaculture. Complementing these perspectives, the tutorials address digitally assisted auto-calibration for robust analog and mixed-signal circuits, as well as the growing role of machine learning throughout the VLSI design process.
At the heart of the conference are three corresponding poster and oral sessions, in which authors will share research across analog and mixed-signal design, semiconductor devices, electronic design automation, hardware security, quantum computing, AI accelerators, biomedical and IoT systems, and energy-efficient computing. By placing each poster session immediately before its corresponding oral session, the program encourages both close discussion around individual projects and the concise exchange of ideas with the wider conference community.
I am deeply grateful to our Honorary Chair, Chua-Chin Wang; Program Chairs, Xin-Yu Shih and Tzung-Je Lee; Program Co-Chair, M. Sangeetha; Publicity Co-Chair, K. Vijayakumar; Finance Chair, Ya-Hsin Hsueh; and General Secretary, Aman Sinha, as well as every committee member and volunteer whose dedication has shaped this conference. I would especially like to thank Leenus J Martin (SRM Institute of Science & Technology), our General Co-Chair, for his leadership and steadfast partnership in bringing PACCAS 2026 to fruition.
Our sincere appreciation also goes to the keynote and tutorial speakers, authors, reviewers, session chairs, institutional partners, and supporters whose contributions have made this program possible. Their collective effort has created not only a forum for presenting technical achievements, but also a welcoming environment in which young researchers can learn, participate, and form lasting professional connections.
While you are with us, I hope you will also enjoy the distinctive energy of Kaohsiung, the beauty of the National Sun Yat-sen University campus, and the warm hospitality of southern Taiwan. May PACCAS 2026 inspire new ideas, meaningful collaborations, and friendships that continue well beyond the conference.
Welcome to PACCAS 2026, and thank you for being part of this important gathering.
